Samsung Electronics Co., Ltd.

Yeonjoo Kim

Yunhee Kim

Doohwan Lee

Jongkook Kim

JeongHo Lee

Hongwon Kim

Junmo Koo

A semiconductor package includes a base substrate, an interposer package disposed on the base substrate, and first and second semiconductor chips disposed on the interposer package, the interposer package includes a first redistribution layer, a bridge chip including a bridge circuit, and a vertical connection structure including a plurality of wiring layers, and wherein each of the first semiconductor chip and the second semiconductor chip is electrically connected to the bridge circuit and the plurality of wiring layers through the first redistribution layer.

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Seoul, South Korea

Yeonjoo Kim