This inventor holds 1 USPTO granted patent. Top assignee: Gemtek Technology Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yen-Yu Lai and a Patent for Communication Module Cooling and Shielding.
Introduction
Yen-Yu Lai is an inventor associated with Hsinchu, Taiwan. His patent work includes a design that combines thermal management and electromagnetic shielding for an optical fiber communication module.
Latest Patents
The provided information lists one patent for Lai: “Communication Assembly and Heat Dissipation Shielding Module Thereof.” The invention describes a communication assembly designed for placement on a substrate. It includes an optical fiber communication module and a heat dissipation shielding module that cools the optical module and protects it from external electromagnetic interference.
The shielding cover and substrate form an accommodation space containing the optical fiber communication module. The cover makes thermal contact with the module, while a heat sink formed as one piece with the cover helps dissipate heat. The design brings cooling and shielding functions together in a single assembly. Lai’s listed patent count is 1 patent.
Career Highlights
Lai is associated with Gemtek Technology Co., Ltd. His listed patent reflects work on communication hardware, with a focus on managing heat and reducing exposure to electromagnetic interference.
Collaborations
Chih Yao Hsu is identified as Lai’s coworker. The information provided does not specify whether she collaborated with him on this patent.
Conclusion
Yen-Yu Lai’s listed invention integrates a heat sink and shielding cover to support the cooling and protection of an optical fiber communication module.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile