Location History:
- Taipei, TW (2006)
- Sinjhuang, TW (2015)
- New Taipei, TW (2017 - 2023)
Company Filing History:
5 out of 534 
1 out of 39 Years Active: 2006-2023
Title: Yen-Lin Chu: Innovator in Heat Dissipation Technologies
Introduction
Yen-Lin Chu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technologies, holding a total of 6 patents. His innovative designs focus on improving the efficiency of thermal management systems.
Latest Patents
One of his latest patents is a heat dissipation device with multiple heat dissipation zones. This device includes a base that has a first surface in contact with at least one heat source and an opposite second surface featuring a heat dissipation zone. An auxiliary heat dissipation zone extends horizontally from one of the lateral sides of the heat dissipation zone, along with an air guiding section defined at the auxiliary heat dissipation zone. This design allows for effective airflow to cool multiple heat sources simultaneously.
Another notable patent is a thermal module assembling structure. This structure comprises a heat sink with multiple radiating fins, at least one leaf spring, and a shaft rod. The heat sink is assembled on the leaf spring, which features engagement posts that facilitate the connection of the holding member. This innovative assembly enhances the efficiency of thermal management in various applications.
Career Highlights
Yen-Lin Chu has worked with several companies, including Asia Vital Components Co., Ltd. and Asia Vital Component Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in thermal technologies.
Collaborations
Throughout his career, Yen-Lin has collaborated with notable individuals, including Sheng-Huang Lin and Yuan-Yi Lin, who is a woman. These collaborations have fostered innovation and the development of new technologies in the field.
Conclusion
Yen-Lin Chu is a distinguished inventor whose work in heat dissipation technologies has made a significant impact. His innovative patents and collaborations highlight his commitment to advancing thermal management solutions.