Company Filing History:
Years Active: 2013
Title: Yen Hua Lin: Innovator in MEMS Technology
Introduction
Yen Hua Lin is a prominent inventor based in Taiwan, renowned for his contributions to the field of Micro-Electro-Mechanical Systems (MEMS). With a focus on optimizing desiccant usage in MEMS packages, Lin's innovative approach enhances the reliability and performance of these sophisticated devices.
Latest Patents
Yen Hua Lin holds a patent for the "Optimization of desiccant usage in a MEMS package." This invention addresses the critical need for a moisture-free environment in MEMS devices. By selecting or treating desiccants to be compatible with specific MEMS devices, Lin's invention minimizes undesirable effects that moisture can have on performance. Notably, the process includes baking the desiccant to facilitate outgassing of moisture or other harmful materials, as well as modifying the structure of the MEMS device to improve compatibility with chosen desiccants.
Career Highlights
Lin is associated with Qualcomm MEMS Technologies, Inc., a company at the forefront of MEMS innovation. His work here exemplifies the integration of advanced materials and engineering principles to develop state-of-the-art MEMS solutions. With one patent to his name, Lin's contributions significantly advance the capabilities of MEMS technology in various applications.
Collaborations
Throughout his career, Yen Hua Lin has collaborated with talented individuals like Rihui He and Lingling Wu. These partnerships foster an environment of innovation, where collective expertise drives the development of cutting-edge technologies.
Conclusion
Yen Hua Lin's innovative work in optimizing desiccant usage reflects his commitment to enhancing MEMS technology. With his patent contributing significantly to the field, his efforts continue to shape the future of MEMS packaging and functionality. As an integral part of Qualcomm MEMS Technologies, Inc., Lin remains a key figure in pushing the boundaries of what is possible in this exciting area of engineering.