The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2013

Filed:

Sep. 28, 2007
Applicants:

Yen Hua Lin, Taiwan, CN;

Rihui He, San Jose, CA (US);

Lingling Wu, San Jose, CA (US);

Lauren Palmateer, San Francisco, CA (US);

David Heald, Solvang, CA (US);

Inventors:

Yen Hua Lin, Taiwan, CN;

Rihui He, San Jose, CA (US);

Lingling Wu, San Jose, CA (US);

Lauren Palmateer, San Francisco, CA (US);

David Heald, Solvang, CA (US);

Assignee:

QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.


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