Yen-Hua Kuo

Title: Yen-Hua Kuo: Innovator in Semiconductor Packaging

Introduction

Yen-Hua Kuo is a prominent inventor based in Luzhu, Taiwan, known for his contributions to the field of semiconductor packaging. With a total of 2 patents, Kuo has made significant advancements that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Kuo's latest patents include innovative designs for semiconductor package substrates. The first patent, titled "Semiconductor package substrates having pillars and related methods," describes a substrate that features a first dielectric layer, a first circuit pattern, a plurality of pillars, and a second circuit pattern. This design allows for improved electrical connections and efficient space utilization. The second patent, "Semiconductor package substrates having layered circuit segments, and related methods," outlines a package substrate that includes a core, multiple first circuit segments, and conductive pillars. This invention focuses on enhancing the reliability and performance of semiconductor packages.

Career Highlights

Yen-Hua Kuo is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in developing advanced packaging solutions that meet the growing demands of the electronics industry.

Collaborations

Kuo collaborates with talented professionals in his field, including colleagues Sheng-Ming Wang and Hsiang-Ming Feng. Their combined expertise contributes to the success of their projects and the advancement of semiconductor technology.

Conclusion

Yen-Hua Kuo's contributions to semiconductor packaging through his innovative patents and collaborative efforts highlight his role as a key figure in the industry. His work continues to influence the development of more efficient and reliable semiconductor devices.