Yen-Chu Chen

Title: Yen-Chu Chen: Innovator in TSV Structures

Introduction

Yen-Chu Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of through-silicon via (TSV) structures. His innovative work focuses on enhancing the performance and efficiency of semiconductor devices.

Latest Patents

Yen-Chu Chen holds a patent for a TSV structure having insulating layers with embedded voids. This patent describes a unique design that includes a chip layer, a dielectric liner, and a conductive filler. The structure features at least one via reentrant from the semiconductor body of the chip layer. A plurality of air-gap cavities are formed on the sidewall of the via, which have a depth-to-width ratio of not less than one. The dielectric liner covers the sidewall of the via without filling into the air-gap cavities, while the conductive filler is disposed in the via, also without filling into the air-gap cavities. This design allows for the formation of an air insulating layer with enclosed voids, ultimately improving the RC delay of the TSV structure.

Career Highlights

Yen-Chu Chen is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging and testing. His work at Powertech has allowed him to apply his innovative ideas in practical applications, contributing to advancements in the industry.

Collaborations

Yen-Chu Chen has collaborated with several talented individuals in his field, including Ming-Yi Wang and Chao-Shun Chiu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Yen-Chu Chen's contributions to the field of semiconductor technology, particularly through his patent on TSV structures, highlight his innovative spirit and dedication to improving electronic devices. His work continues to influence the industry and pave the way for future advancements.