Taichung, Taiwan

Yen-Ching Chu

This inventor holds 1 USPTO granted patent. Top assignee: Giant Manufacturing Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yen-Ching Chu. Retrieved from https://idiyas.com/inventor/yen-ching-chu-nvkce7vt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations by Yen-Ching Chu in Bicycle Fitting Technology.

Introduction

Yen-Ching Chu is an innovative inventor based in Taichung, Taiwan. He has made significant contributions to the field of bicycle fitting technology. His work focuses on enhancing the cycling experience through improved fitting methods.

Latest Patents

Yen-Ching Chu holds a patent for "Methods and systems for bicycle fitting." This patent describes a method that includes receiving evaluation factors based on various scenario parameters. It involves positioning the saddle and handlebar to optimal positions while a user is pedaling. The method determines values for the evaluation factors using data from sensors and processes these values to recommend ideal positions for the saddle or handlebar.

Career Highlights

Yen-Ching Chu is associated with Giant Manufacturing Co., Ltd., a leading company in the bicycle industry. His work at Giant has allowed him to focus on innovative solutions that enhance the performance and comfort of cyclists.

Collaborations

Yen-Ching Chu collaborates with talented individuals such as Ya-Han Chang and Chang-Hsin Hsieh. Their teamwork contributes to the development of advanced bicycle fitting technologies.

Conclusion

Yen-Ching Chu's innovative approach to bicycle fitting showcases his commitment to improving cycling experiences. His patent and collaborations highlight the importance of technology in enhancing sports performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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