Edmonds, WA, United States of America

Yelina Rosillo



Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2018-2020

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2 patents (USPTO):Explore Patents

Title: Yelina Rosillo: Innovator in Composite Structures

Introduction

Yelina Rosillo is a prominent inventor based in Edmonds, WA (US). She has made significant contributions to the field of composite structures, particularly in the integration of electronic devices within these materials. With a total of two patents to her name, Rosillo is recognized for her innovative approaches to manufacturing and design.

Latest Patents

Yelina Rosillo's latest patents include an integrated wiring system for composite structures. The first patent describes a composite part that comprises an electronic device and a method for making the same. In this invention, a primer is deposited on the surface of the composite part, followed by the deposition of a group of conductive elements on the primer. This design allows for power to be supplied to a device connected to the composite part through current flowing through the conductive elements. The second patent outlines a method for manufacturing a composite part, where layers of composite material are cured to form the final product. A primer is again depicted on the surface, and a group of conductive elements is deposited to create an electronic device.

Career Highlights

Yelina Rosillo is currently employed at The Boeing Company, where she applies her expertise in composite materials and electronic integration. Her work has been instrumental in advancing the capabilities of composite structures in aerospace applications.

Collaborations

Some of her notable coworkers include Hardik Dalal and Jeffrey Lynn Duce, who collaborate with her on various projects within the company.

Conclusion

Yelina Rosillo's innovative work in the field of composite structures showcases her dedication to advancing technology in aerospace. Her patents reflect her commitment to integrating electronic devices into composite materials, paving the way for future advancements in the industry.

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