Yeguang Pan

Title: Yeguang Pan: Innovator in Carrier Wafer Technology

Introduction

Yeguang Pan is a notable inventor based in Camas, WA (US). He has made significant contributions to the field of materials science, particularly in the development of carrier wafers. His innovative approach has led to advancements that are crucial for various applications in the semiconductor industry.

Latest Patents

Yeguang Pan holds a patent for "Carrier wafers and methods of forming carrier wafers." This patent describes a method of forming a carrier wafer that includes lapping both surfaces to achieve a substantially flat profile. The carrier wafer is made from glass, glass-ceramic, or ceramic material, with a diameter ranging from 250 mm to 450 mm and a thickness between 0.5 mm and 2 mm after lapping. Additionally, the first surface of the carrier wafer is polished using differential pressure, speed, or time, resulting in a convex or concave shape.

Career Highlights

Yeguang Pan is currently employed at Corning Incorporated, a leading company in materials science and glass technology. His work at Corning has allowed him to explore and develop innovative solutions that enhance the performance and efficiency of carrier wafers.

Collaborations

Throughout his career, Yeguang Pan has collaborated with talented individuals such as Lance Changyong Kim and Fei Lu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Yeguang Pan's contributions to the field of carrier wafer technology exemplify his dedication to innovation and excellence. His patent and work at Corning Incorporated highlight the importance of advancements in materials science for the future of the semiconductor industry.