Hangzhou, China

Ye Yao

This inventor holds 1 USPTO granted patent. Top assignee: Zhejiang Dahua Technology Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ye Yao. Retrieved from https://idiyas.com/inventor/ye-yao-pdg5ulbg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Ye Yao - Innovator in Packaging Technology

Introduction

Ye Yao is a notable inventor based in Hangzhou, China. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique packaging apparatus that enhances efficiency and functionality.

Latest Patents

Ye Yao holds a patent for an apparatus with elastic sheets for packaging. This invention provides a packaging structure that includes a main body with one or more base plates and elastic sheets. Each base plate features two opposite first side edges, two opposite second side edges, and an opening. The elastic sheets correspond to the base plates and are physically connected to the main body, covering at least part of the opening. This design aims to improve the overall packaging process.

Career Highlights

Ye Yao is associated with Zhejiang Dahua Technology Co., Ltd., where he continues to innovate in packaging solutions. His work has garnered attention for its practicality and effectiveness in various applications.

Collaborations

Ye Yao collaborates with talented coworkers, including Qiujia Fu and Xiantao Zeng. Their combined expertise contributes to the advancement of packaging technologies within their organization.

Conclusion

Ye Yao's contributions to packaging technology exemplify the spirit of innovation. His patent for an apparatus with elastic sheets showcases his commitment to improving packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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