Shanghai, China

Ye Lian

This inventor holds 1 USPTO granted patent. Top assignee: China Unionpay Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ye Lian. Retrieved from https://idiyas.com/inventor/ye-lian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Ye Lian - Innovator in Data Processing Technologies

Introduction

Ye Lian is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of data processing, particularly through his innovative patent. His work focuses on enhancing the efficiency and reliability of data reading and writing processes.

Latest Patents

Ye Lian holds a patent for a "Method for data reading and writing processing, data center, disaster recovery system and storage medium." This patent outlines a method that includes receiving a data reading request, determining user identifications, and forwarding requests to a second data center for processing. This innovative approach aims to improve data management and disaster recovery systems.

Career Highlights

Ye Lian is associated with China UnionPay Co., Ltd., where he applies his expertise in data processing technologies. His role at the company allows him to contribute to advancements in financial technology and data management solutions.

Collaborations

Ye Lian has worked alongside talented colleagues, including Daili Li and Xudong Tang. Their collaborative efforts have fostered an environment of innovation and creativity within their projects.

Conclusion

Ye Lian's contributions to data processing technologies exemplify the impact of innovative thinking in the tech industry. His patent reflects a commitment to improving data management systems, showcasing his role as a key inventor in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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