Ishikawa, Japan

Yasuyuki Takehara

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2016-2020

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3 patents (USPTO):Explore Patents

Title: Yasuyuki Takehara: Innovator in Semiconductor Technology

Introduction

Yasuyuki Takehara is a prominent inventor based in Ishikawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and designs that enhance the performance and reliability of semiconductor packages.

Latest Patents

Takehara's latest patents include a semiconductor package and a manufacturing method for semiconductor packages. The semiconductor package features a substrate with at least one recessed portion, housing a semiconductor device on its surface. This design is complemented by a resin insulating layer that covers the semiconductor device, ensuring its protection and functionality. The method for manufacturing a semiconductor package involves a support substrate with a stress relaxation layer, a semiconductor device, and an encapsulation material. This encapsulation material is made from an insulating material that differs from that of the stress relaxation layer, creating a robust and efficient semiconductor package.

Career Highlights

Yasuyuki Takehara is currently employed at J-Devices Corporation, where he continues to innovate in the semiconductor industry. His expertise and dedication have positioned him as a key player in the development of advanced semiconductor technologies.

Collaborations

Takehara collaborates with notable colleagues, including Kiyoaki Hashimoto and Kazuhiko Kitano. Their combined efforts contribute to the advancement of semiconductor technology and the successful execution of innovative projects.

Conclusion

Yasuyuki Takehara's contributions to semiconductor technology through his patents and work at J-Devices Corporation highlight his role as a leading inventor in the field. His innovative designs and methods continue to shape the future of semiconductor packaging.

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