Yasuyoshi Kuroka

Title: Yasuyoshi Kuroka: Innovator in Wafer Polishing Technology

Introduction

Yasuyoshi Kuroka is a notable inventor from Nishigou-mura, Japan, recognized for his contributions to the field of wafer polishing technology. With a total of 2 patents to his name, Kuroka has developed innovative methods that enhance the efficiency and precision of wafer processing.

Latest Patents

Kuroka's latest patents include a method and apparatus for mirror-like polishing of wafer chamfers with orientation flats. This method involves rotating the wafer while it is pressed by a rotating buffering wheel under predetermined pressure. The invention allows for stable mirror-surface polishing of wafer chamfers using a relatively simple control system. It is based on the principle that the wafer rotation speed has low inertial mass and low rotation speed, enabling high response properties and accuracy in control compared to pressing pressure and buffering wheel control. The system also features detection means that identify the intrinsic peripheral parts, corners, and orientation flat parts of the wafer, allowing for precise control of the wafer rotation speed based on the detected polishing position.

Career Highlights

Throughout his career, Yasuyoshi Kuroka has worked with prominent companies, including Shin-Etsu Handotai Co., Ltd. His work has significantly impacted the semiconductor industry, particularly in improving wafer processing techniques.

Collaborations

Kuroka has collaborated with notable professionals in his field, including Fumihiko Hasegawa and Toshihiro Tsuchiya. These collaborations have contributed to the advancement of wafer polishing technologies and innovations.

Conclusion

Yasuyoshi Kuroka's innovative approaches to wafer polishing have established him as a key figure in the semiconductor industry. His patents reflect a commitment to enhancing the precision and efficiency of wafer processing, making significant contributions to technological advancements.