Tokyo, Japan

Yasutoshi Ohtou

This inventor holds 1 USPTO granted patent. Top assignee: Nihon Parkerizing Co., Ltd.. Active years: 2001.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Yasutoshi Ohtou: Innovator in Composite Plating Technology

Introduction

Yasutoshi Ohtou is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of composite plating technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of plating processes.

Latest Patents

Ohtou holds a patent for an "Apparatus for composite plating the inner surface of a cylindrical body." This invention involves a rod-shaped electrode inserted into a cylindrical body, where composite plating liquid flows upward in the annular space between the electrode and the inner surface. Electric power is applied between the rod-shaped electrode and the cylindrical body to achieve composite plating. The design includes a baffle plate positioned above the cylindrical body to counteract the upward flow of the composite plating liquid, ensuring a more effective plating process. He has 1 patent to his name.

Career Highlights

Ohtou is associated with Nihon Parkerizing Co., Ltd., a company known for its advancements in surface treatment technologies. His work has been instrumental in improving the efficiency and effectiveness of plating techniques used in various industrial applications.

Collaborations

Throughout his career, Ohtou has collaborated with talented individuals such as Yoshiyuki Kataoka and Masaaki Beppu. These collaborations have fostered innovation and contributed to the development of new technologies in the field.

Conclusion

Yasutoshi Ohtou's contributions to composite plating technology exemplify the impact of innovative thinking in industrial applications. His patent and work at Nihon Parkerizing Co., Ltd. highlight his role as a key figure in advancing plating processes.

Profile summary based on public USPTO records.
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