Misato, Japan

Yasushi Oguma

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 121(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: Yasushi Oguma: Innovator in Heat-Insulating Technology

Introduction

Yasushi Oguma is a notable inventor based in Misato, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative designs for heat-insulating containers. His work is characterized by a focus on improving the functionality and efficiency of paper containers.

Latest Patents

Yasushi Oguma holds a patent for a heat-insulating paper container and the method for producing the same. This invention features a body member and a bottom panel member, where part of the outer surface of the body member is printed with an organic solvent-based ink. A thick foamed heat-insulating layer made of a thermoplastic synthetic resin film is formed in the printed area, while a less thick foamed layer is created in the non-printed area. This innovative design enhances the thermal insulation properties of the container, making it suitable for various applications.

Career Highlights

Yasushi Oguma is associated with Nihon Dixie Company Limited, where he has been instrumental in developing new packaging solutions. His expertise in material science and engineering has allowed him to create products that meet the demands of modern consumers. His dedication to innovation has positioned him as a key player in the industry.

Collaborations

Yasushi has collaborated with talented coworkers such as Akira Iioka and Kenji Ishii. Together, they have worked on various projects that aim to advance packaging technology and improve product sustainability.

Conclusion

Yasushi Oguma's contributions to heat-insulating technology exemplify the importance of innovation in packaging. His patented designs not only enhance functionality but also address environmental concerns. His work continues to influence the industry and inspire future advancements in packaging solutions.

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