Yasuo Oku

Title: Yasuo Oku: Innovator in Component Mounting Technology

Introduction

Yasuo Oku is a prominent inventor based in Yamanashi, Japan. He has made significant contributions to the field of component mounting technology, holding a total of 6 patents. His innovative designs have enhanced the efficiency and functionality of electronic component assembly.

Latest Patents

One of Yasuo Oku's latest patents is a component mounting system. This system includes a storage that retains information related to a tape feeder and the carrier tape pitch fed by the tape feeder. It features a detector that identifies when the carrier tape is nearing a component shortage. A determiner assesses whether to execute predetermined processing concerning the termination portion of the carrier tape based on the stored information. Additionally, a notifier alerts the operator about the necessary processing actions when required.

Another notable patent is the feeder exchanging carriage. This invention comprises a reel holder for a carrier tape that stores electronic components, a feeder holder for the tape feeder, and a base unit equipped with front and rear wheels. The telescopic unit allows for the adjustment of the distance between the front and rear wheels, optimizing the carriage's functionality when mounted to an electronic component mounter.

Career Highlights

Yasuo Oku is currently employed at Panasonic Intellectual Property Management Co., Ltd. His work has been instrumental in advancing the technology used in electronic component mounting systems. His innovative spirit and technical expertise have positioned him as a key figure in his field.

Collaborations

Yasuo Oku has collaborated with notable coworkers, including Chikara Takata and Yasuo Takanami. Their combined efforts have contributed to the development of cutting-edge technologies in the industry.

Conclusion

Yasuo Oku's contributions to component mounting technology reflect his dedication to innovation and excellence. His patents continue to influence the efficiency of electronic component assembly processes.