Ikoma, Japan

Yasuo Izumi


Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 170(Granted Patents)


Company Filing History:


Years Active: 1991-1994

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11 patents (USPTO):Explore Patents

Title: Yasuo Izumi: Innovator in Electronic Component Bonding Technologies

Introduction

Yasuo Izumi, based in Ikoma, Japan, is a distinguished inventor recognized for his significant contributions to the field of electronic components. With a total of 11 patents under his name, Izumi has made notable advancements that streamline and improve the bonding processes of electronic components.

Latest Patents

Two of Yasuo Izumi's latest patents exemplify his innovative approach to electronic component manufacturing. The first patent details a **Wire Clamping Device and Method**, which incorporates a fixed arm and a movable arm designed to clamp bonding wire during wire bonding. This device uses a piezoelectric element to create mechanical deformation, allowing the movable arm to bend and secure the wire effectively between the arms. The method allows for precise bending towards a fixed arm by applying voltage to the piezoelectric element, ensuring high reliability during electronic component bonding.

The second patent outlines a **Method for Connecting an Electronic Component with a Substrate**. This process creates an effective connection between a sensitive component and a substrate using cream solder, specifically allowing the fragile component to withstand lower reflow temperatures. The method entails applying flux, mounting components, and strategically heating portions of the substrate to secure the electronics. Additionally, Izumi’s method includes steps to connect unwashable electronic components with washable ones to enhance versatility in substrate applications.

Career Highlights

Yasuo Izumi is currently employed at Matsushita Electric Industrial Co., Ltd., where he continues to drive innovation in electronic manufacturing techniques. His extensive experience in the industry is reflected in his portfolio of patents, which address challenges in the production and assembly of electronic parts.

Collaborations

During his career, Izumi has collaborated with notable coworkers, including Yutaka Makino and Kazumi Ishimoto. Their joint efforts have contributed to the development of innovative solutions within their field, facilitating advancements in electronic component technology.

Conclusion

Yasuo Izumi’s dedication to innovation and excellence in electronic component bonding is evident through his patents and collaborative efforts. His recent inventions promise to enhance the efficiency and effectiveness of electronic manufacturing, establishing him as a leading inventor in his field.

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