The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 1994
Filed:
Sep. 08, 1992
Yasuo Izumi, Ikoma, JP;
Syoji Sato, Neyagawa, JP;
Hiroshi Yamauchi, Kadoma, JP;
Ryoji Inutsuka, Katano, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.