This inventor holds 1 USPTO granted patent. Top assignee: Nippondenso Co., Ltd.. Active years: 1986.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1986
Title: Yasumi Ohsera: Innovator in Heat Radiating Insulation Technology
Introduction
Yasumi Ohsera is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of thermal insulation technology, particularly through his innovative patent related to heat radiating insulation for coils. His work exemplifies the intersection of material science and engineering.
Latest Patents
Yasumi Ohsera holds a patent for a heat radiating insulation that utilizes a thermosetting synthetic resin composition. This composition primarily consists of an epoxy resin that is melted at temperatures ranging from 70°C to 130°C. After incorporating a filler, the mixture is kneaded and rapidly cooled. The final product includes a thixotropy agent and a leveling agent, alongside the epoxy resin and a curing agent. Notably, aluminum is added as a filler, constituting 30 wt % to 100 wt % of the mixture. The resulting powder is then coated onto a coil and cured, providing effective heat radiating insulation.
Career Highlights
Yasumi Ohsera is associated with Nippondenso Co., Ltd., a company known for its advancements in automotive technology and components. His work at Nippondenso has allowed him to focus on innovative solutions that enhance the efficiency and performance of thermal insulation materials.
Collaborations
Yasumi Ohsera has collaborated with Hitoshi Harada, a talented coworker who has contributed to the development of his patented technology. Their partnership highlights the importance of teamwork in driving innovation and achieving successful outcomes in research and development.
Conclusion
Yasumi Ohsera's contributions to heat radiating insulation technology demonstrate his commitment to innovation and excellence in material science. His patent reflects a significant advancement in the field, showcasing the potential for improved thermal management solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile