Susono, Japan

Yasumasa Hiyoshi

This inventor holds 2 USPTO granted patents. Top assignee: Mitsubishi Aluminum Company, Ltd.. Active years: 1998-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasumasa Hiyoshi. Retrieved from https://idiyas.com/inventor/yasumasa-hiyoshi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 1998-1999

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Yasumasa Hiyoshi: Innovator in Extrusion Technology

Introduction

Yasumasa Hiyoshi is a notable inventor based in Susono, Japan. He has made significant contributions to the field of extrusion technology, holding a total of 2 patents. His work has been instrumental in advancing manufacturing processes, particularly in the aluminum industry.

Latest Patents

Hiyoshi's latest patents include a variable section extrusion die set and a variable extrusion molding method. These innovations are designed to enhance the efficiency and versatility of extrusion processes, allowing for more complex shapes and improved material flow.

Career Highlights

Yasumasa Hiyoshi is currently employed at Mitsubishi Aluminum Company, Ltd. His role at the company has allowed him to apply his inventive skills to real-world applications, contributing to the company's reputation as a leader in aluminum manufacturing.

Collaborations

Hiyoshi has collaborated with notable colleagues such as Masatsugu Kato and Shigeo Sano. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Yasumasa Hiyoshi's contributions to extrusion technology exemplify the impact of innovation in manufacturing. His patents and collaborative efforts continue to shape the future of the aluminum industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…