Osaka, Japan

Yasuhito Tomochika

This inventor holds 1 USPTO granted patent. Top assignee: Koyo Seiko Company, Ltd.. Active years: 1991.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhito Tomochika. Retrieved from https://idiyas.com/inventor/yasuhito-tomochika

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1991

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yasuhito Tomochika: Cutting-Tool Tip Inventor

Introduction

Yasuhito Tomochika is an inventor associated with Osaka, Japan, and Koyo Seiko Company, Ltd. His documented patent concerns a cutting-tool tip designed to apply substantial compressive residual stress to the material being cut.

Latest Patents

Tomochika’s listed patent is “Tip for a Cutting Tool.” The tip has four cutting portions, each with first and second rake surfaces set at negative angles relative to the tip’s upper surface. The first angle has a smaller absolute value than the second. The second rake surface is farther from the tip’s center and behind the first rake surface in the cutting direction. This arrangement is intended to apply heavy compressive residual stress to the workpiece. The available information lists 1 patent for Tomochika.

Career Highlights

Tomochika’s recorded invention focuses on cutting-tool geometry and the stresses produced during machining. The available information associates him with Koyo Seiko Company, Ltd.

Collaborations

Yoshiki Fujimoto and Ryoki Kameno are identified as Tomochika’s coworkers. The available information does not specify their roles in developing or patenting the cutting-tool tip.

Conclusion

Yasuhito Tomochika’s documented patent reflects an engineering approach to cutting-tool design, using the arrangement and angles of rake surfaces to influence machining stresses.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…