Yasuhisa Sekiya

Title: Yasuhisa Sekiya: Innovator in Grinding Technology

Introduction

Yasuhisa Sekiya is a notable inventor based in Okazaki, Japan. He has made significant contributions to the field of grinding technology, holding three patents that showcase his innovative approach to improving grinding wheels.

Latest Patents

One of his latest patents is for a grinding wheel that features abrasive tips for both rough and finish grinding. This design allows for superhigh-precision surface roughness using a single grinding wheel. The abrasive tips are bonded to a disk-type base and include a lower layer that has a different Young's modulus compared to the rough grinding tips. This unique configuration enables the grinding wheel to effectively handle both rough and finish grinding tasks.

Another significant patent is for a CBN grinding wheel, which consists of a circular core and an abrasive layer made from high and medium toughness CBN grains. The innovative aspect of this design is the specific ratio of high toughness CBN grains, which ranges from 10-80% by weight, enhancing the performance and durability of the grinding wheel.

Career Highlights

Throughout his career, Yasuhisa Sekiya has worked with prominent companies such as Toyoda Van Moppes Ltd. and Jtekt Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in grinding technology.

Collaborations

Yasuhisa has collaborated with talented individuals in his field, including Masato Kitajima and Tomohiro Inagaki. These partnerships have fostered innovation and the development of cutting-edge grinding solutions.

Conclusion

Yasuhisa Sekiya's contributions to grinding technology through his patents and collaborations highlight his role as a leading inventor in this specialized field. His work continues to influence the industry and improve manufacturing processes.