Sakai, Japan

Yasuhiro Nakatake

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Sharp Kabushiki Kaisha Corporation. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhiro Nakatake. Retrieved from https://idiyas.com/inventor/yasuhiro-nakatake

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Yasuhiro Nakatake: Connecting-Wire Invention

Introduction

Yasuhiro Nakatake is an inventor associated with Sakai, Japan, and Sharp Kabushiki Kaisha Corporation. His patent work includes an invention focused on improving the reliability of connecting wires.

Latest Patents

Nakatake is credited with 1 patent, titled “Connecting wire.” The invention describes a method for shaping an organic insulating film between adjacent connecting wires to help prevent electrical leakage and moisture entry. Overexposure using a mask with a sharp-tipped protruding pattern makes the film’s inclined surface more gradual. This helps prevent resist from becoming too thick along the film’s edge and remaining between neighboring wires, reducing the risk of leakage.

Career Highlights

Nakatake’s documented patent contribution addresses a practical challenge in connecting-wire fabrication: maintaining reliable insulation between adjacent wires. The patent identifies resist buildup near the edge of an organic insulating film as a potential source of unwanted electrical connection and presents a patterning approach intended to mitigate that risk.

Collaborations

Nakatake’s listed coworkers include Yasuhiro Mimura and Tomofumi Kubota. His patent is associated with Sharp Kabushiki Kaisha Corporation.

Conclusion

Yasuhiro Nakatake’s connecting-wire patent describes a fabrication technique designed to reduce leakage and moisture-related reliability concerns in adjacent wiring.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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