Yasuhiro Emoto

Title: Yasuhiro Emoto: Innovator in Chip Mounting Technology

Introduction

Yasuhiro Emoto is a notable inventor based in Fukuoka, Japan. He has made significant contributions to the field of electronic component mounting technology. With a total of 3 patents, Emoto's work focuses on improving the efficiency and accuracy of chip mounting apparatuses.

Latest Patents

One of his latest patents is a changing method for separation facilitation head in a chip mounting apparatus. This innovation employs a structure that allows for the detachable keeping of various separation facilitation heads within a wafer ring holding part. A moving mechanism enables the chip separation facilitation unit to access the separation facilitation head keeping part, allowing for automatic changes between the heads without requiring operator intervention. This advancement significantly enhances the operation rate of the apparatus.

Another important patent is related to an electronic component mounting apparatus and method. In this system, a chip is taken from a component supply portion to be mounted onto a board held by a board holding portion. A second camera, moved by a camera moving mechanism, captures an image of a supply portion reference mark. The camera coordinates system is calibrated based on this image, ensuring stable pick-up accuracy by compensating for any aging variations due to thermal changes in the camera mechanism.

Career Highlights

Yasuhiro Emoto has worked with prominent companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these organizations has contributed to his expertise in electronic component technologies.

Collaborations

Emoto has collaborated with notable coworkers, including Hideyuki Yakiyama and Tadashi Shinozaki. Their joint efforts have likely played a role in advancing the technologies they worked on together.

Conclusion

Yasuhiro Emoto's innovations in chip mounting technology demonstrate his commitment to enhancing operational efficiency in electronic component assembly. His patents reflect a deep understanding of the challenges in this field and provide solutions that benefit the industry.