Dongguan, China

Yaqin Hong

This inventor holds 1 USPTO granted patent. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yaqin Hong. Retrieved from https://idiyas.com/inventor/yaqin-hong-ob91hdn2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yaqin Hong and His Patent for a Support Assembly

Introduction

Yaqin Hong is an inventor based in Dongguan, China, and is associated with Huawei Technologies Co., Ltd. His patent work includes a design for a support assembly that can be used in a protection mechanism, motor assembly, and electronic device.

Latest Patents

Hong is named on 1 patent: “Support Assembly, Protection Mechanism, Motor Assembly, and Electronic Device.” The invention describes a rotating shaft mechanism with a rotating assembly comprising first and second fastening pieces, a connecting piece, and a connection rod assembly. The fastening pieces sit on the same side of the connecting piece, with opposing sliding slots on their facing end surfaces. The support portion includes three support boards, with the second board rotatably connected to the first and third boards.

Career Highlights

Hong’s listed patent reflects work on mechanical support and rotation structures intended for integration into electronic and motor-related devices. His association with Huawei Technologies Co., Ltd. connects this invention to a company active in technology development.

Collaborations

Hong’s listed coworkers include Biaoke Zhong and Shengli Hu. Their shared association provides context for the professional network surrounding his patent work.

Conclusion

Yaqin Hong’s patent describes a multi-part support and rotating assembly designed for use in electronic and motor-related applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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