Austin, TX, United States of America

Yaoyu Pang


Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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3 patents (USPTO):Explore Patents

Title: Innovations of Yaoyu Pang

Introduction

Yaoyu Pang is a notable inventor based in Austin, TX, who has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, he has demonstrated a commitment to advancing innovation in his industry.

Latest Patents

One of his latest patents involves a via structure for semiconductor dies. This invention describes a semiconductor die that can be coupled to a printed circuit board using a solder ball. The semiconductor die features a redistribution layer formed above a semiconductor chip, a polymer layer on the redistribution layer, and an Under Bump Metallurgy (UBM) layer on the polymer layer. The polymer layer contains multiple vias that electrically connect the UBM layer to the redistribution layer. Notably, the UBM layer is designed with a continuously flat upper surface for effective coupling to the solder ball. The positioning of the vias is such that they are centered on a point that is not central to the UBM layer, showcasing innovative design.

Career Highlights

Yaoyu Pang is currently employed at Cirrus Logic Inc., where he continues to work on cutting-edge technologies in the semiconductor field. His expertise and innovative mindset have contributed to the company's success in developing advanced electronic components.

Collaborations

Some of his coworkers include Steven A. Atherton and Kathryn Rose Holland, who collaborate with him on various projects within the company.

Conclusion

Yaoyu Pang's contributions to semiconductor technology through his patents and work at Cirrus Logic Inc. highlight his role as an influential inventor in the industry. His innovative designs continue to pave the way for advancements in electronic components.

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