Dongguan, China

Yaohua Tian

This inventor holds 1 USPTO granted patent. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yaohua Tian. Retrieved from https://idiyas.com/inventor/yaohua-tian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yaohua Tian and Connector Technology

Introduction

Yaohua Tian is an inventor based in Dongguan, China. His patent work includes connector technology intended to improve signal transmission and grounding performance. The provided information identifies Huawei Technologies Co., Ltd. as his company and lists 1 patent.

Latest Patents

The listed patent, “Connector, Connector Assembly, and Electronic Device,” describes a ground conductive assembly with a conductive housing and a first ground terminal. The housing has two cavities and opposite ends, with one end configured to connect to a peer connector. The ground terminal extends into the second cavity and electrically connects to its inner wall.

At the housing’s other end, a lead frame contains multiple signal terminal groups, with shield layers arranged on both sides. The design shortens the connector’s ground return path and is intended to improve transmission rates.

Career Highlights

Tian’s listed invention focuses on connector design for electronic devices, combining grounding and shielding features with signal terminals. The available information associates his work with Huawei Technologies Co., Ltd.

Collaborations

The provided information names Xiangqian Lu and Kou Xu as Tian’s coworkers. It does not specify their roles in the listed patent.

Conclusion

Yaohua Tian’s listed patent presents a connector design that integrates grounding, shielding, and signal transmission features to support a shorter ground return path and improved transmission performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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