Fremont, CA, United States of America

Yaochao Yang

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2023

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7 patents (USPTO):Explore Patents

Title: Yaochao Yang: Innovator in Printed Circuit Board Technology

Introduction

Yaochao Yang is a prominent inventor based in Fremont, California. He has made significant contributions to the field of printed circuit board technology, holding a total of seven patents. His innovative methods have advanced the way fiber weaves are assessed in circuit boards, enhancing their reliability and performance.

Latest Patents

Among his latest patents, Yaochao Yang has developed a method for fiber weave skew assessment for printed circuit boards. This method involves inspecting a layer of a printed circuit board through an inspection window, which is formed by an opening in one or more other layers. It identifies the location of a trace aligned with the inspection window, relative to a marker in a fiber bundle of a fiber weave to assess fiber weave skew. Another embodiment of his work includes using an automated optical inspection tool to inspect a fiber weave for printed circuit boards. This method identifies the distance between fiber bundles in the weave, which comprises a plurality of fiber bundles woven together, with some bundles containing markers to facilitate measurement.

Career Highlights

Yaochao Yang is currently employed at Cisco Technology, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in improving the quality and efficiency of printed circuit boards, which are essential components in modern electronic devices.

Collaborations

Some of Yaochao's notable coworkers include Amendra Koul and Mike Sapozhnikov, who have collaborated with him on various projects within the company.

Conclusion

Yaochao Yang's contributions to printed circuit board technology through his innovative patents and work at Cisco Technology, Inc. highlight his role as a key figure in the field. His advancements in fiber weave assessment methods are paving the way for more reliable electronic components.

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