Sunnyvale, CA, United States of America

Yao Wu

This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yao Wu. Retrieved from https://idiyas.com/inventor/yao-wu-smc2nnxs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yao Wu - Innovator in Process Chamber Technology

Introduction

Yao Wu is a notable inventor based in Sunnyvale, CA. He has made significant contributions to the field of process chamber technology. His innovative work has led to the development of a patented invention that enhances manufacturing processes.

Latest Patents

Yao Wu holds a patent for a "Process Chamber Collimator." This invention is designed to improve the efficiency and effectiveness of process chambers used in various manufacturing applications. His patent portfolio includes 1 patent that showcases his expertise in this specialized area.

Career Highlights

Yao Wu is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display technology sectors. His role at the company allows him to apply his innovative ideas and contribute to advancements in technology.

Collaborations

Yao has collaborated with Martin Lee Riker, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Yao Wu's contributions to process chamber technology exemplify his dedication to innovation. His work at Applied Materials, Inc. and his patented invention highlight his role as a key player in advancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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