Yao-Ming Yang

Title: Yao-Ming Yang: Innovator in Semiconductor Packaging

Introduction

Yao-Ming Yang is a prominent inventor based in Chiayi, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging structures. His innovative work has led to the development of a unique semiconductor package structure that enhances the efficiency and reliability of electronic devices.

Latest Patents

Yao-Ming Yang holds a patent for a semiconductor package structure and method of manufacturing the same. This patent describes a semiconductor package structure that includes a chip unit, a package unit, and an electrode unit. The chip unit consists of at least one semiconductor chip, which features an upper surface, a lower surface, and a surrounding peripheral surface. The semiconductor chip is equipped with a first conductive pad and a second conductive pad located on its lower surface. The package unit encompasses a package body that covers the upper surface and the surrounding peripheral surface of the semiconductor chip. Additionally, the electrode unit comprises a first electrode structure that covers one lateral portion and a second electrode structure that covers the opposite lateral portion, ensuring electrical contact with the conductive pads.

Career Highlights

Yao-Ming Yang is associated with Inpaq Technology Co., Ltd., where he continues to innovate in semiconductor packaging. His work has been instrumental in advancing the technology used in various electronic applications.

Collaborations

Yao-Ming Yang has collaborated with notable colleagues, including Chu-Chun Hsu and Wei-Luen Hsu. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.

Conclusion

Yao-Ming Yang's contributions to semiconductor packaging technology exemplify his commitment to innovation. His patent and collaborative efforts highlight the importance of teamwork in advancing technological frontiers.