Taichung, Taiwan

Yao-Kuei Hsiao

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Plastics Industry Development Center. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yao-Kuei Hsiao. Retrieved from https://idiyas.com/inventor/yao-kuei-hsiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations of Yao-Kuei Hsiao in Photosensitive Adhesives

Introduction

Yao-Kuei Hsiao is an accomplished inventor based in Taichung, Taiwan. He has made significant contributions to the field of adhesive technology, particularly through his innovative work on photosensitive adhesives. His research focuses on enhancing the efficiency and cost-effectiveness of manufacturing processes.

Latest Patents

Yao-Kuei Hsiao holds a patent for a photosensitive adhesive. This adhesive is polymerized using a cinnamate monomer and a monomer A. By irradiating the adhesive under different light waves, it triggers reversible cyclization, which causes the adhesion force to change. This change in adhesion force is repeatable, leading to increased efficiency in the manufacturing process and reduced material costs.

Career Highlights

Yao-Kuei Hsiao is currently employed at the Plastics Industry Development Center, where he continues to innovate and develop new adhesive technologies. His work has garnered attention for its practical applications in various industries.

Collaborations

Yao-Kuei has collaborated with notable coworkers, including Kai-Chieh Chang and Chen-Yu Li, who contribute to the research and development efforts at the center.

Conclusion

Yao-Kuei Hsiao's work in the field of photosensitive adhesives exemplifies the potential for innovation in adhesive technology. His contributions not only enhance manufacturing efficiency but also pave the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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