Company Filing History:
Years Active: 2012
Title: Yao-Hui Lin: Innovator in Dicing Technology
Introduction
Yao-Hui Lin is an inventor based in Taipei City, Taiwan. He has made significant contributions to the field of dicing technology, particularly through his innovative approaches to wafer cutting processes. Although he currently holds no granted patents, his work is noteworthy for its potential impact on the semiconductor industry.
Latest Patent Applications
Yao-Hui Lin's latest patent application is titled "DICING PROCESS AND DICING APPARATUS." This application describes a dicing process designed for cutting a wafer along predetermined scribe lines into multiple dies that are releasably adhered to a release film. The process involves several steps: first, a wafer-breaking carrier is disposed on a supporting device, featuring a chipping unit. Next, the wafer is positioned above the supporting device so that the chipping unit aligns with the scribe lines. Finally, a release surface of the release film is adhered to the wafer by applying force, allowing the chipping unit to contact the wafer and split it along the scribe lines into individual dies.
Conclusion
Yao-Hui Lin's innovative dicing process showcases his commitment to advancing technology in the semiconductor field. His contributions, although not yet reflected in granted patents, hold promise for future developments in wafer processing.