Wuhan, China

Yanping Jia

This inventor holds 1 USPTO granted patent. Top assignee: Huazhong University of Science and Technology. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yanping Jia. Retrieved from https://idiyas.com/inventor/yanping-jia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations of Yanping Jia in Ultrasound Imaging

Introduction

Yanping Jia is a notable inventor based in Wuhan, China. He has made significant contributions to the field of ultrasound imaging, particularly through his innovative methods that enhance imaging resolution.

Latest Patents

One of his key patents is the "Split row-column addressing method for three-dimensional ultrasound imaging." This invention addresses the limitations of prior art, specifically the issues of low resolution and the inability to deflect transmitted and received beams. The method involves obtaining pulse-echo response distributions from a fully connected two-dimensional planar array and utilizing various parameters to improve imaging quality.

Career Highlights

Yanping Jia is affiliated with Huazhong University of Science and Technology, where he continues to advance research in ultrasound technology. His work has garnered attention for its practical applications in medical imaging.

Collaborations

He has collaborated with colleagues such as Mingyue Ding and Liushuai Lv, contributing to a dynamic research environment that fosters innovation.

Conclusion

Yanping Jia's contributions to ultrasound imaging through his patented methods exemplify the importance of innovation in medical technology. His work not only addresses existing challenges but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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