Dongguan, China

Yanhua Zhang

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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2 patents (USPTO):Explore Patents

Title: Yanhua Zhang: Innovator in Resin Composition Technology

Introduction

Yanhua Zhang is a notable inventor based in Dongguan, China. He has made significant contributions to the field of resin compositions, particularly in applications for printed circuit boards. His innovative work has led to the development of a patented resin composition that enhances the performance of adhesive films and copper foils.

Latest Patents

Yanhua Zhang holds a patent for a resin composition and its application. The invention includes a resin composition comprising 15-39% cross-linkable curable resin and 61-85% filler. The filler is silicon dioxide, which is prepared through organosilicon hydrolysis. The average particle diameter D50 of the silicon dioxide ranges from 0.1-3 μm, with a D100:D10 ratio of less than or equal to 2.5. The purity of the silicon dioxide exceeds 99.9%. This resin composition is designed to produce adhesive films and resin-coated copper foils with high tensile strength, peel strength, and excellent drilling processability. It is particularly suitable for multilayer laminates in printed circuit board applications.

Career Highlights

Yanhua Zhang is associated with Shengyi Technology Co., Ltd., where he continues to innovate in the field of materials science. His work has been instrumental in advancing the capabilities of printed circuit board materials, especially those requiring fine line processing.

Collaborations

Yanhua Zhang collaborates with talented individuals such as Naidong She and Qianfa Liu. Their combined expertise contributes to the ongoing development of advanced materials in the industry.

Conclusion

Yanhua Zhang's contributions to resin composition technology exemplify the impact of innovation in the field of materials science. His patented work not only enhances product performance but also paves the way for future advancements in printed circuit board applications.

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