Kyoto, Japan

Yang Wu


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: **Innovative Contributions of Yang Wu in Circuit Board Fabrication**

Introduction

Yang Wu, a notable inventor based in Kyoto, Japan, has made significant strides in the field of circuit board technology. With a singular patent to his credit, Wu's work has had a substantial impact on electronic manufacturing processes. His innovative approach focuses on the development of an internal composite layer that enhances the performance and durability of multilayer circuit boards.

Latest Patents

Yang Wu's patent titled "Method of fabricating an internal composite layer" outlines a novel process for constructing an internal composite layer used in multilayer circuit boards. The invention details a method where an electrically insulating substrate is layered with copper and subsequently treated to increase adhesion strength with a coupling agent, like a silane coupling agent. This innovative technique circumvents the typical formation of a copper oxide layer, thereby providing exceptional acid resistance and preventing pink-ring occurrences around through-hole platings.

Career Highlights

Yang Wu is associated with Matsushita Electric Works, Ltd., where his expertise has significantly benefited the company's innovations in electronics. His dedication has positioned him as a valuable asset in the realm of circuit board manufacturing and technology.

Collaborations

Throughout his career, Wu has collaborated with esteemed colleagues such as Hidekazu Takano and Tokio Yoshimitsu, enhancing the creative synergy and output of their collective work. These collaborations foster an environment where innovation can thrive, leading to the development of impactful technologies in their field.

Conclusion

Yang Wu's contributions to circuit board technology exemplify the spirit of innovation. His patent demonstrates not only technical ingenuity but also addresses practical challenges faced in the manufacturing processes of electronic components. As the industry continues to evolve, inventors like Wu pave the way for future advancements that will undoubtedly shape the electronics landscape.

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