Suwon, South Korea

Yang-Seok Park

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electro-Mechanics. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang-Seok Park. Retrieved from https://idiyas.com/inventor/yang-seok-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Yang-Seok Park and His Multilayer Electronic Component Patent.

Introduction

Yang-Seok Park is an inventor associated with Suwon, South Korea, and Samsung Electro-Mechanics. His patent work includes an invention concerning the structure of a multilayer electronic component.

Latest Patents

Park is credited with 1 patent, titled “Multilayer Electronic Component.” The invention describes a component with a body made of stacked dielectric layers and internal electrodes, plus an external electrode connected to the internal electrodes. Its body has an active portion that forms capacitance and cover portions at both ends. The cover portion includes a ceramic wire, with at least one group of wires arranged in a direction.

Career Highlights

Park’s listed patent reflects work on the design and construction of multilayer electronic components. His association with Samsung Electro-Mechanics connects his invention to the company’s work in electronic components.

Collaborations

The available information identifies Samsung Electro-Mechanics as Park’s company but does not specify individual collaborators or co-inventors.

Conclusion

Yang-Seok Park’s patent describes a multilayer electronic component that incorporates ceramic wires into its cover portion, highlighting his contribution to electronic component design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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