This inventor holds 1 USPTO granted patent. Top assignee: Ipenval Consultant Inc.. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Innovations of Yang Ming-Sheng: A Pioneer in Integrated Structures
Introduction: Yang Ming-Sheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated structures, particularly with his innovative patent that enhances the functionality of silicon-through vias. His work is instrumental in advancing technology in this area.
Latest Patents: Yang Ming-Sheng holds a patent for an "Integrated structure with a silicon-through via." This invention includes a substrate, a through-silicon via penetrating the substrate, a conductive protective structure surrounding the through-silicon via, and a first and a second conductive dummy patterns with different shapes disposed between the through-silicon via and the conductive protective structure. This patent showcases his expertise and creativity in developing advanced technological solutions.
Career Highlights: Yang Ming-Sheng is associated with Ipenval Consultant Inc., where he applies his knowledge and skills to further innovations in integrated structures. His work has garnered attention for its potential applications in various technological fields.
Collaborations: Yang has collaborated with esteemed colleagues such as Chen Hwi-Huang and Huang Chao-Yuan. These partnerships have contributed to the development of innovative solutions and have enhanced the impact of his work in the industry.
Conclusion: Yang Ming-Sheng's contributions to the field of integrated structures through his patent and collaborations highlight his role as a significant inventor. His work continues to influence advancements in technology and showcases the importance of innovation in the industry.