Yang Li

Title: Yang Li and Strain-Insensitive Soft Pressure Sensing

Introduction

Yang Li is an inventor associated with The University of Chicago in Chicago, Illinois. His patent work concerns a soft pressure sensor designed to maintain reliable measurements while the sensor stretches or bends.

Latest Patents

The provided information identifies one patent associated with Yang Li: “Strain-Insensitive Soft Pressure Sensor and Method of Measuring Pressure.” The invention uses stretchable top and bottom electrodes with an array of peaked structures between them. The structures are formed by a continuous film over stiffening electrodes, with each peak contacting the top electrode and each stiffening electrode contacting the bottom electrode. Spacers positioned outside the array connect the top electrode and the film. The sensor is designed so its measured capacitance remains substantially invariant under in-plane stretching or bending. Li is credited with 1 patent in the information provided.

Career Highlights

Li’s listed patent reflects work on flexible sensing technology, particularly pressure measurement in applications where a device may deform during use. The provided information associates him with The University of Chicago.

Collaborations

The listed coworkers are Sihong Wang and Qi Su. The provided information does not specify their individual roles in the patent or their broader collaboration with Li.

Conclusion

Yang Li’s patent describes a soft pressure sensor engineered to preserve capacitance-based measurements during stretching and bending, highlighting his contribution to flexible sensing technology.