Hebei, China

Yang Li

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: China Avary Holding (Shenzhen) Co., Ltd., Garuda Technology Co., Ltd., Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang Li. Retrieved from https://idiyas.com/inventor/yang-li-iqs3aqi0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yang Li: Inventor of a Flexible Circuit Board Design

Introduction

Yang Li is an inventor associated with Hebei, China. His listed patent concerns a circuit board designed to accommodate bending while maintaining electrical connections. The available information also links him professionally with electronics manufacturing companies in China.

Latest Patents

Li is credited with 1 patent: “Circuit Board and Method of Fabricating the Same.” The invention describes a circuit board with connecting and bending parts, formed from multiple electrically connected flexible circuit substrates. At the bending part, one substrate has a corrugated region and is positioned over another substrate, creating a spacing between them. Elastic material is placed within this spacing and inside a trough of the corrugated region. The design combines flexible substrates and elastic material in the bending area.

Career Highlights

Li is associated with Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. and China Avary Holding (Shenzhen) Co., Ltd. His patent reflects work related to circuit-board construction and flexible electronic components.

Collaborations

Li’s listed coworkers include Li-Kun Liu and Chao Wang. The available information identifies these professional associations but does not specify their roles in the patent.

Conclusion

Yang Li’s recorded invention focuses on a flexible circuit-board structure that incorporates corrugation and elastic material at a bending section. His patent and company associations connect his work with electronics manufacturing in China.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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