Dongguan, China

Yanbo Du

This inventor holds 1 USPTO granted patent. Top assignee: Apple Inc.. Active years: 2025.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yanbo Du - Innovator in Packaging Solutions

Introduction

Yanbo Du is a notable inventor based in Dongguan, China. He has made significant contributions to the field of packaging, particularly in the design of storage cases for electronic accessories. His innovative approach has led to the development of a unique packaging solution that enhances the organization and security of electronic adapters.

Latest Patents

Yanbo Du holds a patent for a "Packaging and storage case with paper posts for securing accessories such as electronic adapters." This invention features a base panel and a paper post that extends from the base panel. The design includes two side walls and a top panel, with the side walls tapering toward each other. This innovative packaging solution not only secures electronic adapters but also provides a practical and efficient way to store them.

Career Highlights

Yanbo Du is currently employed at Apple Inc., where he continues to innovate and contribute to the company's product offerings. His work focuses on enhancing user experience through effective packaging solutions. With a patent portfolio that includes 1 patent, he has established himself as a valuable asset in the field of product design.

Collaborations

Throughout his career, Yanbo Du has collaborated with talented individuals such as Manuel Hodrius and Kevin T Pagano. These collaborations have fostered a creative environment that encourages the development of innovative solutions in packaging.

Conclusion

Yanbo Du's contributions to packaging design exemplify the importance of innovation in enhancing product functionality. His patent for a unique storage case demonstrates his commitment to improving the organization of electronic accessories. As he continues to work at Apple Inc., his future endeavors are sure to bring further advancements in the field of packaging.

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