Yan Gex-Collet

Title: Yan Gex-Collet: Innovator in Packaging Technology

Introduction

Yan Gex-Collet is a notable inventor based in Choëx, Switzerland. She has made significant contributions to the field of packaging technology, particularly through her innovative processes for producing packaging welds. Her work is characterized by a focus on efficiency and precision in manufacturing flexible packages.

Latest Patents

Yan Gex-Collet holds a patent for a process for producing a packaging weld. This process involves the continuous welding of a sheet of plastic material, which is essential for the manufacturing of flexible packages. The method includes several steps, such as positioning the sheet relative to the welding device, contacting the ends of the sheet, and forming a weld through heating, pressing, and cooling. Additionally, the process utilizes a sensor to acquire a primary temporal signal that is proportional to the thickness of the weld. This signal is then transformed into a primary frequency signal, allowing for the definition of various frequency spectrums and the reconstruction of a secondary low-frequency signal to determine the thickness of the weld.

Career Highlights

Yan Gex-Collet is associated with Aisapack Holding SA, where she applies her expertise in packaging technology. Her innovative approach has led to advancements in the efficiency of packaging processes, making her a valuable asset to her company and the industry.

Collaborations

Yan has collaborated with notable colleagues, including Jacques Thomasset and Gaël Bussien. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies in packaging.

Conclusion

Yan Gex-Collet is a pioneering inventor whose work in packaging technology has made a significant impact on the industry. Her patented process for producing packaging welds exemplifies her commitment to innovation and efficiency.