This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yae Jung Yoon: Semiconductor Package Inventor.
Introduction
Yae Jung Yoon is an inventor based in Hwaseong, South Korea. She is associated with Samsung Electronics Ltd. and is credited with 1 patent.
Latest Patents
Yoon’s patent, “Semiconductor Package Including Connecting Pads,” describes a semiconductor package with a T-shaped connecting pad. Its first portion penetrates a passivation film, while its second portion extends into a mold layer. The package also includes a solder ball, an element, a wiring structure with an insulating layer and wiring pattern, and a semiconductor chip.
Career Highlights
Yoon’s recorded patent work concerns semiconductor packaging, including the arrangement of connecting pads and related package components. Her listed company affiliation is Samsung Electronics Ltd.
Collaborations
Yoon’s listed coworkers include Eung Kyu Kim and Min Jun Bae.
Conclusion
Yae Jung Yoon’s patent documents her contribution to semiconductor package design through a structure that integrates T-shaped connecting pads with wiring and chip components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile