Ya-Yu Hsieh

Title: Innovations of Ya-Yu Hsieh

Introduction

Ya-Yu Hsieh is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing semiconductor package structures and methods for die attaching.

Latest Patents

One of his latest patents is a semiconductor package structure. This innovation features a semiconductor die with an active surface and a conductive bump designed to electrically couple the semiconductor die to an external circuit. The conductive bump has a specific height, and the structure includes a dielectric that encapsulates both the semiconductor die and the conductive bump, along with a plurality of fillers, each with a diameter smaller than the bump height. Another patent involves a method for die attaching. This method outlines a process where at least one die and a die-attach preform are provided separately. The die-attach preform is placed on a die carrier, followed by the die being positioned on the preform. The die and die carrier are then heated and clipped to ensure that the die-attach preform adheres to both components simultaneously.

Career Highlights

Ya-Yu Hsieh is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor packaging.

Collaborations

He collaborates with talented coworkers, including Chin-Li Kao and Chung-Hsuan Tsai, who contribute to his projects and innovations.

Conclusion

Ya-Yu Hsieh's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a significant inventor in the field. His work continues to influence advancements in semiconductor packaging and die attachment methods.