Ya-Wen Kuo

Title: Innovations of Ya-Wen Kuo

Introduction

Ya-Wen Kuo is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of printed circuit board technology. With a total of two patents to his name, Kuo's work focuses on enhancing the dimensional stability of multi-layer printed circuit boards.

Latest Patents

Kuo's latest patents include innovative designs for multi-layer printed circuit boards that feature improved dimensional stability. The first patent describes a multi-layer printed circuit board that comprises a core with a core insulation layer and traces formed on both sides of the core insulation layer. This design includes multiple insulation layers sequentially formed on either side of the core, along with trace layers positioned between the insulation layers and on the outermost insulation layers. The core insulation layer is made from a resin material that differs from that of the insulation layers, providing superior dimensional stability.

Career Highlights

Ya-Wen Kuo is currently employed at Elite Material Co., Ltd., where he continues to innovate in the field of electronic materials. His work has been instrumental in advancing the technology behind printed circuit boards, making them more reliable and efficient for various applications.

Collaborations

Kuo collaborates with talented coworkers, including Li-Chih Yu and Ching-Hsin Ho, who contribute to the innovative environment at Elite Material Co., Ltd. Their teamwork fosters creativity and drives the development of cutting-edge technologies.

Conclusion

Ya-Wen Kuo's contributions to the field of printed circuit boards exemplify the importance of innovation in technology. His patents reflect a commitment to enhancing product performance and reliability. Kuo's work continues to influence the industry and inspire future advancements.