This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Htc Corporation. Active years: 2017-2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2021
Title: Innovations of Inventor Ya-Lin Hsiao
Introduction
Ya-Lin Hsiao is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of heat transfer technology, holding a total of 4 patents. His work focuses on enhancing the efficiency of electronic devices through innovative heat management solutions.
Latest Patents
One of his latest patents is a heat transferring module designed to efficiently manage heat from heating elements. This module consists of a first plate, a second plate, and a working fluid, creating a cavity that facilitates heat transfer through convection and conduction. Another significant patent involves an electronic assembly that includes a circuit board, a heat-generating element, and a heat pipe. This assembly allows for improved thermal coupling, which enhances the overall efficiency of electronic devices.
Career Highlights
Ya-Lin Hsiao is currently employed at HTC Corporation, where he continues to develop innovative solutions in electronic assembly and heat management. His work has been instrumental in advancing the technology used in modern electronic devices.
Collaborations
He collaborates with talented coworkers, including Hung-Wen Lin and Hsin-Chih Liu, who contribute to the innovative projects at HTC Corporation.
Conclusion
Ya-Lin Hsiao's contributions to heat transfer technology and electronic assembly have made a significant impact in the field. His innovative patents reflect his commitment to enhancing the efficiency of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile