Htc Corporation

Ya-Lin Hsiao

Yu-Jing Liao

Ying-Yen Cheng

Hsin-Chih Liu

Hung-Wen Lin

A heat transferring module adapted to contact a heating element is provided. The heat transferring module includes a first plate, a second plate and a working fluid. The second plate is connected to the first plate to form a cavity therewith, and the cavity extends along an extension direction of a reference plane. The working fluid is located in the cavity, wherein the cavity is a first area, and a portion of the first plate or a portion of the second plate extending beyond the cavity is a second area. The first area transfers heat by heat convection, and the second area transfers heat by heat conduction.

Heat transferring module

An electronic assembly including a circuit board, a heat-generating element, and a heat pipe is provided. The heat-generating element includes a bottom surface and a side surface connected to the bottom surface. The heat-generating element is mounted on the circuit board via the bottom surface. The heat pipe is thermally coupled to the side surface of the heat-generating element to absorb heat from the heat-generating element. Additionally, an electronic device includes a casing, a display, and the above-described electronic assembly. The display is mounted on the casing. The electronic assembly is disposed in the casing. The heat-generating element is mounted on the circuit board and its side surface is thermally coupled to the heat pipe. As a result, the limitation on the thickness of the heat pipe is relaxed, thereby allowing the efficiency of the heat pipe to be increased.

Electronic assembly and electronic device

An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet assembled with the upper sheet to form a chamber, and a working fluid disposed in the chamber.

Electronic device

An electronic device and a heat dissipation plate are provided. The electronic device includes a frame or a housing, a first heat generating component, a second heat generating component and a heat pipe, and the heat dissipation plate includes the frame and the heat pipe. The heat pipe is installed at the frame or housing and has branches. An orthogonal projection of the heat pipe on the frame or the housing overlaps at least part of orthogonal projections of the first heat generating component and the second heat generating component on the frame or the housing.

Growing community of inventors

Taoyuan, Taiwan

Ya-Lin Hsiao