Taipei, Taiwan

Ya-Hwei Tseng

This inventor holds 3 USPTO granted patents. Top assignee: Compal Electronics, Inc.. Active years: 2007-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ya-Hwei Tseng. Retrieved from https://idiyas.com/inventor/ya-hwei-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 242(Granted Patents)


Company Filing History:


Years Active: 2007-2009

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3 patents (USPTO):Explore Patents

Title: The Innovations of Ya-Hwei Tseng

Introduction

Ya-Hwei Tseng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the design and development of notebook computers. With a total of three patents to his name, Tseng represents the innovative spirit of the tech industry.

Latest Patents

Ya-Hwei Tseng's latest patents focus on advancements in notebook computer technology. These patents reflect his commitment to enhancing user experience and pushing the boundaries of portable computing devices.

Career Highlights

Throughout his career, Tseng has made a notable impact while working at Compal Electronics, Inc. His role in the company has allowed him to work on cutting-edge projects that contribute to the future of computing technology.

Collaborations

In his journey as an inventor, Tseng has collaborated with esteemed colleagues, including Chih-Wen Chiang and the talented woman inventor Yun-Tung Pai. These partnerships highlight the collaborative nature of innovation and the importance of teamwork in bringing new ideas to fruition.

Conclusion

Ya-Hwei Tseng stands as a testament to the innovative capabilities within the tech industry. With his dedication, notable patents, and collaborative efforts, Tseng continues to shape the future of notebook computing. His contributions are sure to leave a lasting impact on technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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