Ya-Cheng Liu

Title: Innovations by Ya-Cheng Liu in Wafer Surface Inspection

Introduction

Ya-Cheng Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the inspection of wafer surfaces. His innovative approach has led to the development of a unique inspection method that enhances the detection of defects on wafer surfaces.

Latest Patents

Ya-Cheng Liu holds a patent for an "Inspection method for inspecting defects of wafer surface." This invention provides a systematic approach to identifying defects by utilizing a first and second light source set to encircle the peripheral region of the wafer surface. The method involves alternating the light irradiation from different directions, allowing an image pick-up module to capture scattered light images. These images are then processed to obtain a clear and enhanced defect image of the wafer surface.

Career Highlights

Ya-Cheng Liu is currently employed at the National Applied Research Laboratories, where he continues to work on advancements in semiconductor inspection technologies. His expertise in this area has positioned him as a valuable asset to his organization and the broader research community.

Collaborations

Ya-Cheng Liu collaborates with talented colleagues, including Hsin-Yi Tsai and Kuo-Cheng Huang. Their combined efforts contribute to the ongoing research and development in the field of wafer inspection.

Conclusion

Ya-Cheng Liu's innovative methods in wafer surface inspection demonstrate his commitment to advancing semiconductor technology. His contributions are essential for improving the quality and reliability of semiconductor manufacturing processes.