The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Aug. 30, 2012
Hsin-yi Tsai, Hsinchu, TW;
Kuo-cheng Huang, Hsinchu, TW;
Ya-cheng Liu, Hsinchu, TW;
Min-wei Hung, Hsinchu, TW;
Hsin-Yi Tsai, Hsinchu, TW;
Kuo-Cheng Huang, Hsinchu, TW;
Ya-Cheng Liu, Hsinchu, TW;
Min-Wei Hung, Hsinchu, TW;
National Applied Research Laboratories, Taipei, TW;
Abstract
The present invention provides an inspection method for inspecting defects of wafer surface. The method includes: encircling peripheral region of the wafer surface by a first light source set and a second light source set; using a control module to control the first light source set and the second light source set to irradiate the light alternately from different directions; using an image pick-up module to receive a scattered light image during each time when the first light source set or the second light source set irradiates the light on the wafer surface; and then using a process module to obtain an enhanced and clear defect image of wafer surface by processing each of the scattered light images.